Used LAPMASTER 15 #9411972 for sale

LAPMASTER 15 is a precision grinding, lapping, and polishing equipment designed for high-end industrial and research applications. With a 15-inch grinding plate, LAPMASTER 15 handles polishes and grinds up to one-inch thick wafers with a unique and reliable polishing process. This process eliminates damage to delicate wafer surfaces due to excessive heating or surface abrasion. The precision grinding and polishing offered by 15 is achieved through the combination of high-torque, brushless DC motors, rugged mechanical components, and precision machined plates and wheels. This high degree of control allows the user to accurately adjust the grind, lapping, and polishing parameters to their needs. The grinding plate of the system has a width of LAPMASTER 15-inches and a height that adjusts between 0 and 4 inches, making it suitable for processing a wide range of wafers. The unit is controlled via a customizable touch-screen controller, with a 3-axis joystick for precise positioning. 15 utilizes a combination of grinding and polishing techniques to achieve maximum results without damage. The grinding and polishing of wafers can be done dry or wet, with programmable adjustments for particle size, pressure, and flow rate to enable precise control over the entire process. Additionally, the machine can measure and monitor grinding and polishing parameters such as tool speed, polishing speed, and plate type. In addition to its advanced capabilities, LAPMASTER 15 is designed for easy maintenance and low cost of ownership. Its modular design allows for easy access to parts and components for repairs and routine maintenance. Additionally, 15 utilizes specialized consumables and diamond tools for long-lasting performance and consistent results. LAPMASTER 15 is an effective solution for a wide range of industrial and research applications. Its high degree of control and reliable polishing results make it a perfect choice for precision grinding, lapping, and polishing of wafers.