Used LAPMASTER 15C #9150537 for sale

LAPMASTER 15C is a computer-controlled wafer grinding, lapping and polishing equipment designed to precision polish and finish parts up to 12" (300 mm) in size within 5 micron (0.000197") accuracy. The system is ideal for grinding and polishing high-precision surfaces in the production of precision optics, medical equipment, MEMS devices and other components requiring a superior surface finish. 15C unit consists of a main computer-controlled machine with an integrated software-controlled touch screen. The machine is designed to provide the optimal grinding, lapping and polishing conditions for a wide variety of substrates, including silicon and gallium nitride. The machine has two independent and programmable motion axes (X and Y) with load-capacity of up to 15 kg (33 lbs), allowing for precise positioning of the workpiece. LAPMASTER 15C is designed to hold substrates up to 12" (300 mm) in diameter, with a velocity range from 0.01 to 800 rpms. The interface display allows the user to select the compatible grinding, lapping and polishing processes, as well as offers a range of process parameters for fine-tuning the process. The machine is also equipped with a built-in vacuum machine for part handling and cooling. The main computer-controlled tool has Wi-Fi communication capability allowing for remote control and monitoring. 15C is designed to provide outstanding performance and the lowest cycle times possible while delivering excellent surface finish qualities, even at high speeds and feedrates. The asset is also designed to be easy to repair and maintain with in-field service available by trained technicians. The machine also includes an automatic calibration model which ensures that the grinding, lapping and polishing processes are performed with the same precision and surface finish time after time. This equipment is ideal for precision applications with tolerances of 5 micron (0.000197") or less.