Used LAPMASTER 24 #293807456 for sale

LAPMASTER 24 is a high-precision wafer grinding, lapping and polishing equipment which provides superior to high-end performance for applications requiring ultra-smooth, optically-flat surfaces. This system uses patented grinding wheel and abrasive belt technologies and provides excellent grinding and polishing results, capable of achieving high-quality and low defect surface flatness, equivalent to a polishing quality having a peak-to-valley (P-V) value up to 0.5 nanometer. The unit is designed with a 24-inch/610mm maximum workpiece size capacity and a high-speed 50/60Hz motor suitable for grinding and lapping, diamond lapping and polishing operations. Its patented floating pressure head maintains a constant grinding pressure across the entire lapped or polished surface, providing superior results for various applications. The machine includes a central control unit for process management and data logging, enabling users to achieve excellent wafer flatness, surface finish, defect-free feature anomaly detection, uniformity and reduced wastage from the process. LAPMASTER 24 also offers precision spindle installation and cleaning which helps to maintain better accuracy and repeatability in the process. The grinding wheel and abrasive belt technologies used within this tool offers precision grinding, capable of achieving great success in improving surface flatness and surface finish. The asset's high speed and low vibration enables it to offer higher accuracy and throughput than conventional grinding processes. The large grinding wheel size also allows for increased precision in wafer machining, providing a higher rate of throughput for each wafer. 24 is equipped with a large worktable, allowing the processing of larger wafers with multiple assignments, making it suitable for production operations. It also offers superior repeatability between applications with its precision workpiece clamp and positioning systems. Additionally, high-precision diamond-dressed grinding wheels are available for even better results. In conclusion, LAPMASTER 24 is a high-precision wafer grinding, lapping and polishing model offering great advantages over traditional processes. Its superior accuracy, repeatability and throughput capabilities make it an ideal choice for production operations requiring ultra-smooth, optically-flat surfaces.