Used LAPMASTER 24 #9251574 for sale

LAPMASTER 24 is an advanced and fully automated wafer grinding, lapping and polishing equipment designed for high-volume production of single-side or double-side lapped and polished wafers. It features fully automated operation from loading and grinding to polishing and unloading. This system utilizes advanced technology such as computer-controlled grinding and polishing operations for superior result. 24 has a large-diameter grinding polishing wheel that has been specially engineered to maximize the grinding and polishing yield. LAPMASTER 24 is highly efficient and reliable due to its unique designs, which include an advanced automatic grinding/polishing mechanism and precise machining centers. 24 offers an integrated grinding and lapping unit that includes a dynamically balanced grinding and lapping wheel, a servo-controlled lapping table, and an integrated load control machine. This highly efficient tool allows for efficient grinding and lapping of precision flat and planar wafer surfaces. LAPMASTER 24 reduces cycle time by automatically controlling the lapping parameters to maintain the desired wafer flatness and parallelism. This asset also features a unique Low Stress process that yields finer grinding and lapping results while minimizing the number of cycles. 24 is also designed to be cost effective and to increase the yield. The model eliminates any manual labor, thereby reducing operational costs. The equipment's unique design also offers superior process repeatability. Furthermore, LAPMASTER 24 is equipped with a library of parameters, which allow customers to easily customize and recreate processes. This ensures a consistent wafer grinding, lapping, and polishing process every time. 24 is truly a machine that offers high quality and reliability. Its advanced and automated operation enables manufacturers to produce wafers at an unprecedented rate, with superior surface finishing. With its cost effective, highly efficient, and precise design, LAPMASTER 24 is the perfect system for wafer grinding, lapping, and polishing needs.