Used LAPMASTER 24 #9277081 for sale

LAPMASTER 24 is a computer controlled wafer grinding, lapping, and polishing equipment. It is designed for fast, efficient, and accurate lapping of precision materials, producing highly precise surfaces with superior flatness and homogeneity. This system utilizes state-of-the-art advancements in CNC technology to enable precision operation and repeatability of lapping and polishing results. It is ideal for tight tolerance operations in medical, automotive and consumer electronics, as well as flat panel displays, solar cells, and similar products. 24 features a solid aluminum frame, integrated precision-torque slide and linear drive arrays, a precision spindle rotor, and a central cut display. The unit comes with an integrated controller that allows for precise machine control, and it is equipped with optional high speed motors and spindle speed modules. The smooth flow of the grinding, lapping, and polishing operations is enabled by a central cast vacuum unit, with intelligent sensing functions that provide maximum speed and efficiency. The unit also features a closed loop process control machine, which provides feedback and control for precise control over spindle speed, grinding pressure, and contact quality. The versatile control tool makes LAPMASTER 24 extremely effective for a broad range of applications. The asset can be set up to produce precise wafer edges, flatter substrates, and uniform surfaces. The integrated grind stone can be adjusted to achieve the desired surface roughness and polish. The model is also capable of producing low, medium, and high tolerance surfaces with minimal passivation and optimal grinding pressure. The unit further boasts such innovative features as abrasive grinding profiling, in-situ analysis, and even fully automated operations. This feature allows users to quickly and accurately calculate grinder profiles for different configurations and substrates. Additionally, the in-situ analysis capabilities of the equipment allow for a quick and easy change of grinding parameters, and observation of the development of lapping and polishing results. All in all, 24 is a powerful, reliable, and precise wafer grinding, lapping, and polishing system that is designed to produce optimal results in a variety of applications.