Used LAPMASTER 36 #293759817 for sale

LAPMASTER 36 is a wafer grinding, lapping and polishing equipment that is designed to produce high-precision flat surfaces on semiconductor wafers. The system is equipped with a reliable, high-performance scrubbing head, capable of achieving ultra-precise surface finish, line edge roughness and Cpk values for atomic layer deposition and electrochemical deposition. The unit utilizes a high-precision spindle driven by an AC servo motor, which is capable of achieving high cutting and lap concentricity, as well as a high torque speed control. Furthermore, the machine features an adjustable grinding head, advanced wafer loading and unloading tool, and a precision-controlled air suction for enhanced chip removal. 36 is equipped with a user-friendly interface that allows for easy operation and parameters setting. Through the interface, users can control the grinding and lapping process, as well as adjust the X, Y, Z orientation and adjust to the desire wafer thickness. The interface also allows for easy visualization of grinding, lapping and polishing process results, and offers a variety of data logging and output formats. With the help of an adjustable process cycle, the asset can adjust the lapping speed, head position, number of passes, feed rate and the desired force according to the user's specific needs. In addition to its user-friendly operation, LAPMASTER 36 is lightweight and portable, making it a great fit for many semiconductor wafer grinding, lapping and polishing applications. The model makes use of a high-precision, adjustable-angle optical microscope, allowing for the easy observation of the wafer grinding and lapping results. Furthermore, 36 consists of a triple-stage air-suction end effector for optimal chip removal and process control. Furthermore, the equipment is equipped with a robust vacuum system, designed to maximize material removal, as well as an automated, adjustable-temperature lapping/polishing end effector, designed to produce superior quality, ultra-smooth wafer surfaces. LAPMASTER 36 also offers an advanced, noise reduction feature, designed to ensure precise, noise-free operation and improved quality control. This advanced unit is capable of yielding precise surface features, flatness, parallelism, line edge roughness and Cpk-values for a variety of applications.