Used LAPMASTER 36 #9255076 for sale

LAPMASTER 36 is a state-of-the-art wafer grinding, lapping and polishing equipment. This versatile machine is designed for success in a wide range of semiconductor applications. 36 is an all-in-one tool for surface preparation, which enables precision control of multiple operations, including grinding, lapping, and polishing. LAPMASTER 36 system includes a fully motorized multi-axis grinding and polishing head that can be programmed for up to 36 steps of grinding, lapping, and polishing at variable speeds. The unit is designed with a closed-loop part detection machine to ensure a safe and precise operation. The tool includes a particle size analyzer and a residue disc holder, allowing for improved control of in-process particle size distribution. LAPMASTER 36 is designed to work in combination with a variety of abrasives, including diamond, silica, alumina, and ceramics. It has a wide variety of options for wafer sizes, from 1 to 7 inches, as well as multiple function control to ensure the desired result is attained. 36's ultra-precise polishing heads enable accurate grinding and polishing of the wafer in a limited amount of time, maximizing efficiency and throughput. In addition, LAPMASTER 36 is fully-automated and simple to operate. The intuitive touchscreen interface guides the operator through the setup process and enables automated programming for repetitive operations. The machine also includes a built-in vacuum asset for easy cleanup. 36 is a must-have model for the preparation of high-quality, precise semiconductor components. Its high level of automation and versatile function control make it a valuable tool for high speed wafer processing. It is a reliable and versatile machine that can help to reduce costs and save time.