Used LAPMASTER 36 #9274730 for sale

LAPMASTER 36 is a comprehensive wafer grinding, lapping, and polishing equipment designed to meet the needs of advanced device IC manufacturers. With its unique combination of advanced technology, 36 is capable of achieving precise planarization and flatness accuracies on most wafer types. The core of LAPMASTER 36 is its exclusive grinding/lapping/polishing head, which consists of three integrated heads operated by an independent spindle motor. The upper head contains a granite slab which a contoured platen travels across. The middle and lower heads house cotton-based lapping films, which grind, lap, and polish the wafers. The upper and lower heads can be independently moved up and down to adjust the pressure applied to the wafer. With its high speed controlled variable drive motor, 36 is able to provide excellent grinding/lapping/polishing performance without generating excessive heat or damaging existing wafer structures. LAPMASTER 36 includes several safety features, such as the E-STOP function which immediately brings the machine to a halt if the process being carried out becomes unsafe. Additionally, the system automatically detects when wafers have been loaded incorrectly, and prevents them from being processed until they are correctly loaded. The module includes several automation functions, including recipe storage, real-time machine status monitoring, and run-to-complete capabilities. This allows users to easily program and monitor process steps associated with each type of wafer, such as pressure setting, platen speed, and lapping films used. The advanced control unit of 36 facilitates continuous flow operations, making it ideally suited to high volume production facilities. Additionally, the high level of integration and control offered by the machine allows for easy monitoring of process performance, helping to identify problems as soon as they arise. In summary, the advanced features of LAPMASTER 36 make it ideal for device manufactures looking to achieve the highest levels of planarization and flatness accuracies on their wafers. Its combination of sophisticated technology, safety features, and automation functions make it the perfect choice for providing consistently accurate results on a range of wafer types.