Used LAPMASTER 48 #293637433 for sale

LAPMASTER 48 is a precision wafer grinding, lapping, and polishing equipment designed to provide versatile and easy-to-use wafer finishing solutions. The system can handle the widest range of wafer sizes up to 5 inches to deliver consistent and repeatable results. It features a range of grinding, lapping, and polishing operations that are configured to accommodate unique customer requirements. The core of 48 is the highly precise, multi-axis drive unit that, with the addition of different tooling, helps to provide more enhanced grinding, lapping, and polishing capabilities. This drive machine is combined with a custom-designed controller that gives users the ability to quickly and accurately input all processing parameters for automation of the grinding, lapping, and polishing process. Additionally, the controller also provides enhanced control parameters and results feedback. LAPMASTER 48 offers advanced grinding, lapping, and polishing capabilities including ultra-precision accuracy, contamination control, and high throughput rates. Its powerful motorized spindles can process wafers at up to 1000 rpm, while the easily-configurable tooling and precision grinding tool allow for speed and accuracy. 48 also offers automated temperature control, allowing it to keep track of the in-process temperatures on the wafer surface and adjusting the process to meet the user's desired goals.This function helps to reduce wear on the grinding and lapping tools, resulting in lower cost of ownership. Furthermore, the asset is equipped with advanced monitoring and control processes that help to ensure reliable, reproducible results with each wafer. In addition, LAPMASTER 48 features an intuitive intuitive user-friendly interface that offers greater control flexibility. Process and operation parameters such as speed, pressure, and temperature can all be adjusted with the touch of a button. Furthermore, the model utilizes a bespoke intuitive graphical software to provide real-time graphical updates and automated data collection. This important information helps to further improve the quality, speed, and reproducibility of the grinding, lapping, and polishing process. Overall, 48 is a powerful and versatile wafer grinding, lapping, and polishing equipment that delivers superb quality, results and value for money.