Used LAPMASTER 48" #9199489 for sale

LAPMASTER 48 is a wafer grinding, lapping & polishing equipment, designed to meet the needs of the precision wafer processing industry. This advanced system is built with high-precision components, allowing it to precisely polish and grind optical components or substrates, as well as wafer slices. The unit features an inclusive software package, which allows users to program specific grinding, lapping and polishing functions for optimum performance. Its integrated inverter motor with encoder feedback provides for drastically improved response time and control. LAPMASTER 48 offers a unique, controlled polishing and grinding process in the form of a Digital Polishing Machine (DPS). The DPS gives the user the ability to control the rotation rate and pressure of the grinding and polishing process with precision accuracy. The tool also includes two integrated, analog polishing controllers, which can be adjusted to a specific speed and pressure setting. LAPMASTER 48 is also equipped with an adjustable knife cutting asset (A-model). This equipment uses an adjustable knife-cutting head that allows the user to hone the lapping and grinding tools used in the process. The knife-cutting head also has a manual fine-adjustment capability, so that users can fine-tune the size of the tools used for more precise processes. LAPMASTER 48 is also equipped with a system for maximum process control and recovery. This unit allows the user to monitor all of the process parameters in real time, so that the user can adjust the parameters accordingly. Along with its machine of precision components and capabilities, LAPMASTER 48 features an AC brushless motor tool, allowing for precise and consistent grinding and polishing operations. Additionally, the asset has a multi-position clamping model, which allows for the entrance, exit and alignment of wafer slices. The equipment also has an integrated sample stage for wafer slices, optimized for single- and multi-die configurations. Overall, LAPMASTER 48 is a comprehensive wafer grinding, lapping and polishing system, designed to meet the needs of the precision wafer processing industry. This advanced unit is built with high-precision components, and offers a unique, controlled polishing and grinding process with an adjustable knife cutting machine. The tool is also equipped with an AC brushless motor asset and a multi-position clamping model. This equipment offers the utmost precision in grinding, lapping and polishing operations, and proves to be an invaluable tool for the wafer processing industry.