Used LAPMASTER 48 #9203948 for sale

LAPMASTER 48 is a state of the art automated wafer grinding, lapping and polishing equipment designed for the full range of various wafer fabrication processes. The system has a modular design, meaning the components can be easily configured for different size requirements, from microscopic ultra thin Si layers (<20um) to ultra thick substrates up to 300mm in diameter. The core structure consists of a vertical machining head assembly consisting of a patented stationary spindle coupled to a precision motor and a multi-axis automated motion unit that can be adjusted in height and tilt to meet the needs of precision wafer grinding and polishing. The supporting grinding/polishing systems has a high-grade electric spindle motor that can generate up to 20,000 RPM and an accuracy of +/- 2 μm. The attached diamond lapping disks are programmed with precision controls for optimal repeatability from wafer to wafer. The wafer grinding, lapping and polishing machine also offers a unique chip controller for efficient, accurate and safe operation of the tool. It is programmed to provide significant reductions in machine setup time and minimum operator interaction. The modular construction also provides the flexibility of incorporating additional components such as a recirculation cooling asset, vacuum filter, air filter blower, light-beam diagnostics and other custom components for specific application needs. The model is also equipped with sophisticated software for convenient setup and operation of the equipment. It supports an intuitive graphical user interface (GUI) that guides the user through the setup and operational processes. The system also provides a comprehensive library of control programs for accurate and repeatable operation. In conclusion, 48 is an advanced, high-performance wafer grinding, lapping and polishing unit designed to meet the needs of the most demanding applications. It is highly configurable and offers exceptional precision and repeatability, making it ideal for applications such as semiconductor device fabrication, optical/optoelectronic polishing and optical thin film production.