Used LAPMASTER 56 #293809816 for sale

LAPMASTER 56 is a highly precise wafer grinding, lapping and polishing machine. Specifically designed for the most demanding on-site applications such as ultra-flat surfaces and tight tolerances, 56 is the ideal solution for achieving the best surface finishing results on silicon, quartz, gallium arsenide, and soft substrates with low thermal resistance. LAPMASTER 56 is built with a heavy duty metal frame and has a 56" working area with up to13.5" working height. The machine is equipped with a variable frequency drive, as well as an integrated lubrication and a sound contact device that allows for continuous and efficient operation. The lapping plate is designed with an extra-large mass for better grinding and lapping performance. The built-in heat exchanger ensures even temperature distribution, which is essential for the production of high-quality flat surfaces. LAPMASTER 56 is easy to operate and features an intuitive user interface. To ensure optimal performance, users can customize their abrasive selection, grinding speed and pressure settings, as well as monitor the temperature of the lapping plate. In addition, the equipment is equipped with a fine-pitch amount adjustment motor, allowing for precise control of the grinding and lapping operations. 56 also incorporates a PLC system that allows users to program the machine to automatically stop once a specific tolerance level has been achieved. LAPMASTER 56 is engineered for quick and easy maintenance. The unit is designed to be disassembled and reassembled quickly, without the need for specialized tools or equipment. The component parts are all machined to extremely tight tolerances, so that there is minimal displacement of machine elements during disassembly and re-calibration. This allows the machine to maintain its high precision over time. Additionally, the lubrication tool is integrated directly into the frame of the machine, minimizing downtime due to contamination and cleaning. In conclusion, 56 is a durable and efficient wafer grinding, lapping and polishing machine that is capable of producing ultra-flat surfaces with tight tolerances. Its robust features, combined with its easy-to-use user interface, make it a great choice for any precision production needs.