Used LAPMASTER 600/2 #9300180 for sale

LAPMASTER 600/2 is a wafer grinding, lapping and polishing system designed to achieve superior flatness and finish on wafers in the semiconductor industry. LAPMASTER 600/2 system offers superior performance in wafer grind, lap and polish processes in three stages, with the ability to process 200mm and 300mm wafers. The integrated system starts the grinding process with a PLC-controlled grinding spindle, where a workpiece is secured on the fixture and grinding is conducted in the Y-axis. The spindle is driven by an AC servo motor, which is monitored and controlled via a frequency converter in order to achieve superior flatness. The grinding spindle is capable of down feed at low speed with excellent force control, resulting in a consistent and uniform grind. The second stage of the lap and polish process is conducted on a precision lapping table. This enables surface planarity, parallelism and finish to exceedingly tight tolerances. It utilizes a specially formulated stone-on-stone contact between wafer and table. The table is driven by an AC servo motor, which is monitored and controlled by a frequency converter. The spindles are in turn connected to servo motors that allow efficient speed control with assured accuracy and repeatability. The final stage of the process is a polishing process, which is controlled by a pressure-on-force controller. The polishing pads are powered by an AC servo motor, and are monitored and controlled by a frequency converter in order to set pre-programmed parameters for the pressure-on-force. LAPMASTER 600/2 is equipped with a touch-screen interface that allows for easy operation and parameter setting during the grinding, lapping, and polishing process. LAPMASTER 600/2 offers unparalleled precision and accuracy across part size, within one series. With its combination of superior performance, control, and monitoring capabilities, LAPMASTER 600/2 is an extremely reliable and cost-effective solution for the most demanding wafer grinding, lapping, and polishing processes.