Used LAPMASTER AL 2 #9255799 for sale

LAPMASTER AL 2 is a wafer grinding, lapping, and polishing equipment. It is designed for automated wafer processing of silicon, sapphire, gallium arsenide, and other semiconductor materials. The machine consists of a chassis, which carries 2 spindles - each of which can be fitted with up to two grinding/polishing units. The machine has two grinding/polishing discs, one for coarse grinding and the other for fine grinding. The discs are driven by the spindles, which can be set to rotate in either clockwise or counter-clockwise direction. The discs are held in place by a vacuum seal created by the control system. This ensures a uniform grinding and polishing process. The machine features a highly accurate, program-controlled feed unit, allowing for precise adjustment of the grinding/polishing pressure. This feed machine can be set up to allow the wafers to move smoothly along a predetermined cycle. The control tool can also be used to synchronize the movement of the grinding/polishing discs. This allows for optimum contact between the grinding/polishing discs and the wafer, ensuring a consistent and uniform finish. AL 2 is equipped with an exchangeable slurry dispenser, designed to optimize the grinding and polishing process. This exchangeable dispenser is able to dispense various types of slurry during the wafer processing cycle, allowing for a precise application of the required material. The slurry dispenser is connected to a water supply asset, which ensures a continuous flow of water during the wafer processing cycle. LAPMASTER AL 2 features a unique, double air plenum model. This equipment uses compressed air to create a pressurized chamber above the wafers, ensuring uniform air flow throughout the wafer processing cycle. This prevents particle contamination during the process. The finished wafers produced by the machine are clean and defect-free, ensuring superior quality in the finished semiconductor device. AL 2 is a reliable and efficient system, capable of supporting a wide range of wafer processing tasks. The machine has been designed specifically to allow for efficient and accurate processing of semiconductor materials, including silicon, sapphire, gallium arsenide, and other materials. It can be used for wafer grinding, lapping, and polishing, with the assurance of excellent quality and precision in the final device.