Used LAPMASTER C12 #9389298 for sale

LAPMASTER C12 is an innovative wafer grinding, lapping, and polishing equipment designed by PR Hoffman Machine Products. C12 uses lapping plates on 8" and 12" wafer sizes to grind, lapping and polishing the surfaces of different semiconductor materials, including silicon, gallium arsenide and gallium nitride. LAPMASTER C12 uses computer-controlled, servo-driven lapping plates to ensure precision results. The system allows users to independently adjust the lapping plate speed and pressure, allowing for precise control over the process and ensuring consistent results. C12 is designed to minimize the abrasive material used when grinding and lapping. Aesthetic cutting action ensures that the tooling and blades move at the same speed, generating a uniform finish. Advanced programmable logic control (PLC) systems allow users to precisely control the speed and pressure of the lapping plates, ensuring consistent results. LAPMASTER C12 also incorporates temperature control systems, which ensure that the temperature of the lapping plates and wafers remain within set parameters during the entire process. This prevents any damage or distortion to the semiconductor material caused by temperature changes. C12 also incorporates safety features to ensure the unit is operated safely. Emergency stop buttons are provided so that if an issue or unexpected incident occurs it can be stopped immediately. The machine is also designed to exclude any type of loose particles such as dust and grinding debris when the lapping and polishing process is underway. LAPMASTER C12's advanced technology and features make it an ideal tool for precision lapping, grinding and polishing of various semiconductor materials. Its robust design, combined with its precise user-controlled settings, ensure that users obtain consistent results that meet their requirements for performance and quality.