Used LAPMASTER LM-15-D2 #9263630 for sale

LAPMASTER LM-15-D2 is a wafer grinding, lapping and polishing equipment designed to provide precise and efficient control of the grinding, lapping and polishing of substrates such as semiconductor and optical wafers. It is suitable for a wide range of applications, including grinding, polishing and lapping of wafers up to 25mm in size. LM-15-D2 features a powerful, custom designed, dual motor spindle system, allowing it to offer superior process control and accuracy. The spindle unit features two stepper motor axes, one for the main platen and one for the fine abrasion platen. This ensures that the process is performed with precision, allowing for improved surface finish and repeatability. LAPMASTER LM-15-D2 is equipped with an advanced, multi-stage LAPMASTER software package, which allows for precise process control and robust parameter management. This software can adjust the gap between the grinding media and the platen to regulate the process, ensuring that uniform and consistent results are achieved. The software also allows for a range of additional features, such as wafer mapping and traceability. LM-15-D2 is capable of providing lapping and polishing pressure levels up to 15,000 Lbs. and can generate uniform finish on wafers up to 25mm in size with surface finish levels of less than 1 Angstrom (RMS). The machine can process wafers in batches up to 25 pieces and in full-length configurations up to 10". LAPMASTER LM-15-D2 is a reliable and cost-efficient tool designed for a wide range of applications, including grinding, polishing, and lapping of wafers. The advanced software package allows for precise process control, as well as traceability and mapping of wafers. The asset is capable of producing a uniform, consistent finish while also being able to maintain tight lapping and polishing pressure levels. Overall, LM-15-D2 is a cost-effective solution for a variety of wafer processing needs.