Used LAPMASTER LM 15 #9156671 for sale

LAPMASTER LM 15 wafer grinding, lapping and polishing equipment is a high quality tool for preparing semiconductor wafers and thin wafers. It is specifically designed to achieve extremely low surface roughness and flatness. LM 15 provides precision wafer processing for all types of applications, featuring a twelve-inch table top with an adjustable speed spindle motor, and digital temperature control. LAPMASTER LM 15 is capable of processing wafers up to 300 microns in thickness, and it can perform various operations including fine grinding, planarizing, lapping, and polishing. LM 15 is a versatile system that offers a variety of wafer grinding, lapping and polishing capabilities. LAPMASTER LM 15 also offers high-precision grinding procedures, such as edge preparation, threading, taper removal, and chamfering. LM 15 features an advanced four-tile platen and diamond grinding wheels for uniform, repeatable wafer grinding, lapping, and polishing. The applied forces, speeds and process parameters are precisely monitored and controlled via the Machine Controller Interface. The diamond grinding wheels come with multi-layer adjustable diamond pads with a variety of diamond grits to suit different substrates. LAPMASTER LM 15 also features a fully adjustable spindle motor with automatic speed control allowing for easy adjustment of the grinding and polishing speeds and processes. This unit is designed for easy operation and maintenance, allowing the operator to quickly change the grinding and polishing operations. LM 15 also features an integrated dust collection machine to keep the work environment clean and safe. LAPMASTER LM 15 is an ideal choice for the semiconductor industry, as it provides a reliable and efficient solution for wafer processing. With its high precision and accuracy, LM 15 can provide optimal performance and cost savings, while the integrated safety features ensure operator safety and protection.