Used LAPMASTER LSP-20 #9366122 for sale

LAPMASTER LSP-20 is a versatile wafer grinding, lapping and polishing equipment designed to perform a wide range of process operations. The user friendly machine provides unsurpassed precision and control when performing complex grinding and lapping operations on all types of semiconductor wafers. LSP-20 is equipped with a motorized diamond turning chuck that allows the user to precisely control the rotation rate of the wafer, enabling extremely accurate grinding, lapping, and polishing. The machine also features two separate independently adjustable process tables, allowing for the use of multiple tools for grinding and surface finishing applications. The system is capable of grinding as thin as 50 microns and is equipped with an automatic disc changing device that accommodates up to eight grinding and polishing discs at one time. LAPMASTER LSP-20 includes a variety of advanced features designed to ensure the highest levels of accuracy and repeatability. The unit is equipped with a PLC-controlled servo drive machine, providing the highest levels of precision when controlling grinding parameters. The machine also features advanced programming capabilities, allowing custom programs to be created for automated complete processing of the wafer. LSP-20 also features an integrated coolant delivery tool, ensuring efficient and consistent cooling throughout the cutting and grinding operations. The machine also includes a two-stage filtration asset, which helps to minimize the potential for contamination of the wafer during processing. LAPMASTER LSP-20 is a state-of-the-art wafer grinding, lapping and polishing model that provides unsurpassed precision and control when performing demanding wafer grinding operations. The equipment is equipped with advanced features and controls to ensure the highest levels of accuracy and repeatability, making it an ideal solution for grinding and lapping operations.