Used LAPMASTER LSP-6 #293810735 for sale

LAPMASTER LSP-6 is a wafer grinding, lapping, and polishing equipment specially designed for wafer processing applications. It is a comprehensive system that provides consistent results with high throughput rates. The unit combines a precision-engineered grinding wheel, lapping plate and polishing head for the processing of many kinds of semiconductor wafers at various sizes and thicknesses. LSP-6 has a number of advanced design features that ensure reliable and consistent precision grinding, lapping and polishing processes. The grinding wheel is driven by a high-torque, brushless DC servo motor which ensures precision control and uniformity of motion. The motor is controlled by an advanced proportional-integral controller for precise and smooth grinding and lapping operations. The integrated laser machine ensures accuracy and consistency throughout the entire process. The integrated lapping plate is designed for uniform and efficient wafer-to-plate contact. The plate features grooves cut into the surface or optically coated for optimal wafer lapping performance and uniformity. The lapping plate also features adjustable springs and vacuum slots to achieve precise wafer-to-plate temperature and pressure profiles. This ensures rapid lapping cycle times, control of the desired wafer removal, and consistency of results. The integrated precision polishing head can be used to obtain optical surface finishes. This is accomplished by using a top-down rotating disc with a precision lapping grid designed to produce optically smooth wafers. A Turbo-Lapper tool, which removes surface adhered particles, is also available as an option for LAPMASTER LSP-6. LSP-6 provides a reliable and cost-effective solution for a wide range of wafer processing applications. It is a versatile asset with a number of features tailored to many wafer types and sizes. With its precise control, efficient operation, and uniform results, it is the perfect choice for many precision wafer processing tasks.