Used LAPMASTER LSP-6 #293810738 for sale

LAPMASTER LSP-6 is a state-of-the-art wafer grinding, lapping and polishing equipment designed for the reliable production and processing of the most challenging photovoltaic, semiconductor, optoelectronic and other technical grade substrates. It features a significant technological advancement over existing systems, allowing its users to rapidly and accurately achieve photolithographic imaging and device processing. This system utilizes a single, multi-axis robotic arm which can quickly move the wafer grinding tool between several stations. This allows the user to perform multiple surface grinding operations on a single wafer in sequence, effectively cutting the time required for each operation. In addition, the robotic arm enables highly precise grinding operations and ensures precise repeatability of the wafer at a level of accuracy not feasible with manual systems. The unit also possesses a high-speed lapping station designed for the processing of very thin substrates. This stage ensures effective lapping at high speed and with high precision. An internal motion monitoring machine ensures that the intensity and movement of the lapping plates is consistent throughout the process, allowing for consistent results. The final stage of the tool is a polishing station, designed to ensure the final, highest quality finish to the substrate. The polishing station features an advanced media dispensing asset, allowing the user to adjust the size and flow rate of the media according to their requirements. The model also features a recirculation equipment, allowing the user to achieve low cycle times and consistent high accuracy throughout the polishing process. When used in conjunction with complementary components from LAPMASTER family, LSP-6 provides a comprehensive, efficient, and cost-effective solution for processing and producing a wide range of advanced substrates. Its advanced features and user-friendly design enable the user to experience a virtually effortless high-precision grinding, lapping and polishing process.