Used LAPMASTER XLP-15 #9224526 for sale

LAPMASTER XLP-15 is a wafer grinding, lapping and polishing equipment designed to achieve highly accurate and precise results in all grinding, lapping and polishing applications. As a computer-controlled system, XLP-15 is able to consistently achieve the desired results with great accuracy and precision. The unit consists of a number of different components, including a platform for lapping and polishing, an adjustable speed drive, an adjustable angle grinding attachment, and a grinding and polishing head. The grinding head includes features such as a vacuum and dust extraction machine which captures the grinding debris and polishing dust for proper disposal. The platform of the tool is designed to be able to accurately control the grinding and polishing process. It has a two-way pressure asset which is adjustable for the user's desired pressure needed for different applications. It also has a built-in auto-indexer for easy repeatability and use of abrasive discs or sheets. The adjustable speed drive allows for precise control over the speed of the grinding and polishing process, as well as for increased safety during the process. The adjustable angle grinding attachment is specifically designed for LAPMASTER XLP-15. It allows the user to accurately grind and polish wafers with any angle - 0° to 180°. This provides increased accuracy and precision during the grinding and polishing process. The grinding and polishing head is also designed to achieve accurate results with a wide range of pressure applications. It is also built with a hydro-pneumatic model for easy repair and maintenance. Overall, XLP-15 is a highly efficient and precise wafer grinding, lapping and polishing equipment. Its components are designed to provide accuracy and precision for a wide range of applications. In addition, the system's adjustable speed drive, adjustable angle grinding attachment, and grinding and polishing head provide an efficient and safe environment for grinding, lapping, and polishing wafers.