Used LAPMASTER XLP-15 #9259360 for sale

LAPMASTER XLP-15 is a wafer grinding, lapping, and polishing equipment from LAPMASTER Wolters. It is used to grind, lap, and polish a variety of single-sided and double-sided wafers made from a variety of materials. The system features a dual-axis CNC-controlled grinding lap that allows for high precision, sub-micron processing on multiple wafer surfaces. The grinding lap has been specially designed to minimize lateral vibration which can lead to irregularities in the surface of the substrate. XLP-15 is well suited for converting large quantities of single-sided and double-sided wafers. It includes a precise grinding and lapping unit that features adjustable settings for different substrate materials. An adjustable linear feed ensures that the wafers will be accurately and uniformly lapped. LAPMASTER XLP-15 is equipped with a unique two-stage cleaning protocol that ensures all of the surfaces of the wafer substrate are completely clean and free of particles. This helps to ensure that the finished wafer is free of any contaminants that could affect the performance of the device or the assembly process. The unit also includes a high-precision polishing chamber that offers a wide range of polishing protocols to ensure a consistent surface finish. This chamber can also be used to dress the wafer, which is the process of removing or shaping the surface of the wafer to obtain the desired result. Finally, XLP-15 includes a precise and reliable linear positioning machine that ensures accurate and uniform processing of the all wafer surfaces. This ensures that the various surfaces of the wafer substrate are lapped, polished, and dressed accurately, every time.