Used LAPMASTER XLP-40FDPC #9208842 for sale

LAPMASTER XLP-40FDPC is a highly advanced wafer grinding, lapping and polishing equipment that offers unprecedented accuracy and repeatability in the production of precision semiconductor components. This automated control system utilizes an extremely powerful, integrated suite of advanced processing technologies that can be tailored to meet the most demanding of exacting silicon wafer applications. The main feature of XLP-40FDPC is the high-precision wafer grinding capability. It is designed to deliver rapid, high-accuracy processing of virtually any size of silicon wafer at a repeatable rate that far surpasses the performance of many traditional machining processes. This unit is equipped with a variable-speed, double-disc spindle that delivers very fine finish quality, along with a low profile body that minimizes overhang and allows smooth leveling during grinding operations. LAPMASTER XLP-40FDPC also includes a lapping and polishing subassembly that is integrated into the main body of the machine. This complex assembly is designed to handle a variety of lapping and polishing operations, including surface correction of the silicon wafer that can eliminate curvature problems. It is also designed to enable precise control of wafer flatness, beveling angles, and surface integrity. The machine additionally features precise clamps and electrodes that are designed to precisely hold the wafer and secure its position. These components are constructed from very hard and highly corrosion-resistant metals, such as steel, that provide maximum performance in challenging environments. XLP-40FDPC also comes with robust software that enables easy setup, configuration, and performance monitoring. This software platform is designed to provide comprehensive support for the entire process - from wafer selection to final inspection. It also provides fault detection, traceability, and error reporting features that ensure the accuracy and repeatability of results throughout the entire process.