Used LAPTECH 32T #9021705 for sale

LAPTECH 32T is a wafer grinding, lapping, and polishing equipment designed to provide advanced polishing and surface conditioning for a wide variety of semiconductors and thin wafers. The result is a smoother surface uniformity for higher quality parts and minimal tooling damage. The system consists of a 32-inch grinding and lapping table outfitted with a diamond polishing compound. The table has adjustable mortars and pestles to provide easy control of lapping pressure, and a variable speed control to create consistent surface finishes. The unit includes an air nozzle to evacuate airborne particles, reducing dust buildup. 32T utilizes a fully automated precision grinding and polishing process. To provide consistent results, the wafers are held securely in place by spring-loaded clamps. Once secure, an optimal cutting surface is achieved by grinding high-precision bits into the wafer. The grinding and polishing process is accomplished in three stages, each utilizing diamond-coated tools. The cutting and grinding stage uses diamond bits to cut through the wafer material and create a rough surface with ultra-fine particles. The lapping stage uses diamond powder and a light slurry solution to refine and smooth the surface, creating uniformity and repellency. As the final step, the polishing stage uses abrasive tools to polish the surface and remove any extraneous particles. These three stages ensure uniform, highly precise cutting edges with minimal damage to the wafer material. LAPTECH 32T is designed with safety in mind and comes with an array of safety features. It has an enclosed cover and a safety sensor to prevent accidental contact with moving parts. A durable service cover and precision grinding table ensure a safe and efficient working environment. Additionally, an electrostatic discharge (ESD) cartridge captures and eliminates static charges generated during the grinding and polishing process, while an air power management machine monitors air pressure to ensure consistent flow. 32T is a versatile wafer grinding, lapping, and polishing tool designed to meet the highest standards for accuracy and precision. It is ideal for a wide variety of semiconductor and thin wafer surfaces, providing ultra-smooth and uniform results with minimal tooling damage. With its cutting edge precision grinding table, automated process control, and a comprehensive safety package, LAPTECH 32T is the optimal asset for achieving the perfect surface finish.