Used LEBLOND-MAKINO CNII-25 #169779 for sale

LEBLOND-MAKINO CNII-25 wafer grinding, lapping & polishing equipment is a high-precision industrial tool designed to provide maximum accuracy and repeatability. This system is equipped with a host of features that enable it to perform a variety of operations, such as removing rough edges, polishing the surfaces of wafers, producing flat surfaces and reducing surface roughness. CNII-25 unit is built around a high-precision table for optimal grinding, lapping, orpolishing of wafers. The grinding/lapping/polishing station is linked to a computerized control unit, which allows for the programmed control of all its functions. The machine also utilizes a combination of fixed and individual controllable grinding/lapping heads with separate motors for each. LEBLOND-MAKINO CNII-25 tool can be used for manual or automated grinding/lapping/polishing opeations. The table allows for easy adjustment of the workpiece surface, and can be used with a wide variety of abrasive materials. The adjustable grinding/lapping heads enable surface preparation at different angles and depths, while the onboard computercontrol allows for fine-tuning of the surface finish and results. The asset features an integrated dust-collection model and spark-suppression equipment to maintain a clean and safe working environment. For increased safety, CNII-25 equipment is equipped with an automatically-actuated emergency stop feature. LEBLOND-MAKINO CNII-25 system is designed to offer high-precision and repeatable results for a variety of applications, including flat surface grinding and polishing, and surface-roughening operations. The unit also provides speed and accuracy control to ensure optimal levels of accuracy and productivity. This machine is designed to be intuitive and user-friendly, enabling users of all skill levels to achieve consistent results.