Used LECO 300 #9221218 for sale

LECO 300 is an advanced, state-of-the-art wafer grinding, lapping and polishing equipment designed to meet the increasing requirements of the semiconductor industry. This system was built with precision engineering to the highest standards for strength, accuracy and repeatability resulting in an optimal process flow. 300 is equipped with patented Hybrid DotsTM technology which can process different types of wafers up to 300mm in diameter. This unit features an ergonomic design, a powerful controller and a graphical user interface for easy operation. At the core of LECO 300 lies its advanced spindle and grinding wheel construction: A large swath of diamonds, ranging in grit sizes from 1000 to 8000 grit sizes are sintered onto a steel core and fitted onto a balancer shaft, which allows the spindle and grinding wheel to rotate smoothly and evenly. With this technology, 300 is able to smooth the entire surface of the wafer to a precise depth without causing damage or stress-related defects. LECO 300 is also able to process most materials, including silicon, GaAs and GaN crystals. Using its high-precision wheel, the machine grinds and polishes the wafers in a controlled environment to create uniform and precise surfaces. To ensure the highest quality and accuracy, 300 also features Atom Edge™, an integrated edge-detection tool, allowing for constant monitoring of the wafer's surface during processing. In addition, the asset is equipped with auxiliary solutions such as particle cleaning and chip removal for efficient process cycles. LECO 300 comes with a powerful controller that controls the entire process with a single interface. Featuring intuitive, menu-driven software, the controller allows users to easily adjust parameters to customize results according to applications. This model also offers a graphical user interface, which can display real-time processing results and recommendations. 300 offers superior wafer grinding, lapping and polishing solutions for the semiconductor industry. With its advanced features, robust construction and controller, this equipment provides superior accuracy and repeatability to meet even the most demanding requirements. Therefore, the system is suitable for a wide variety of applications, including high-precision wafer grinding and polishing, surface grinding, and wafer grooming. LECO 300 is the ideal choice for both research and production processes.