Used LECO AP-600 #9112581 for sale

LECO AP-600 is a sophisticated wafer grinding, lapping, and polishing machine designed for precision wafer processing. This powerful equipment offers robust performance with repeatable processes, fast cycle times, and high-precision results. In its most basic configuration, AP-600 system consists of a base (or platform), planetary head, clamping assembly, grinding/lapping head, and abrasive disk. The base contains a control panel, dust collector, and vacuum supply port. The planetary head is responsible for holding the abrasive disk and providing circular motion to the grinding/lapping head. Meanwhile, the grinding/lapping head holds and grinds a wafer against the abrasive disk in order to achieve the desired surface finish. LECO AP-600 also offers numerous customizable options that can increase the machine's capabilities. These optional features include a vision unit for precise positioning of the wafer, a chuck table for faster cycle times, a high-speed spindle, and a variety of grinding and polishing arms for different size wafers and applications. AP-600 boasts several features that make it uniquely capable of achieving the highest quality surface finish. The computerized controller and ARC software allow for complete wafer control, while the quick-change clamping assembly ensures maximum efficiency. In addition, the oil-free motor provides consistent performance and prevents cross-contamination. LECO AP-600 also offers superior safety features, such as a shut-off switch, adjustable abrasive head standoff, and quick-change abrasive holder assembly. As a result, operators can work without having to worry about potential accidents or damage to the machine. Overall, AP-600 is an innovative and reliable wafer processing machine that is sure to deliver excellent results. With its sophisticated control tool, numerous customizable options, and superior safety features, LECO AP-600 is perfect for meeting the most demanding production requirements.