Used LECO GP-20 #9039443 for sale

LECO GP-20 is a wafer grinding, lapping and polishing equipment designed to provide high precision results for specific applications like MEMS research and production. GP-20's single-wafer system offers efficient and reliable processes while meeting the highest levels of accuracy. It requires minimal manual operation and has high throughput capabilities, enabling the production of many high-quality wafers in a short amount of time. LECO GP-20 features an 8-inch single-wafer chuck that supports up to 50mm wafers and runs at up to 10,000 RPM. The chuck is capable of high tolerance mounting and precise axial and radial alignment to ensure wafer flatness and provides excellent clamping force for improved grinding and polishing processes. It also comes with chip-cleaning nozzles to help reduce the risk of contamination. GP-20 offers programmable lapping and polishing with accurate process control. The process parameters are set by the operator and then the unit will control the speed, pressure, and feed rate for high precision results. It also includes tactile sensors to monitor the grinding and lapping process and automatically adjust the pressure and feed rate for optimal performance. LECO GP-20 also features a built-in electrical isolation chip to prevent circuit faults and a flooding nozzle to flush the surface of the wafer. The nozzle floods the wafer's surface with DI water to reduce any reactions between the abrasive material and the wafer. Once the grinding and lapping process is complete, the wafer is ready for polishing. GP-20 includes an automated diamond slurry dosing machine that can accurately dispense the diamond slurry with high precision. It can be programmed to automatically control the slurry's dispense instructions and parameters such as dosage, time, and pressure. The tool also includes a slurry pump that can accurately measure and dispense the slurry during polishing. LECO GP-20 offers highly accurate results with its combination of advanced features and sophisticated engineering. It is suitable for applications such as MEMS research and production where precision is essential. Its automation and ease of use make it an ideal choice for achieving high yields with minimum cost.