Used LECO MSX-205 #9228653 for sale

LECO MSX-205 is a high-end wafer grinding, lapping, and polishing equipment designed for the production of large-diameter semiconductor wafers. It is capable of supporting a range of wafer sizes ranging from 8 to 12 inches in diameter. The system employs precision-engineered components, such as ball screws, to ensure precise, high-quality performance. The ball screws provide extreme positional accuracy and can be fine-tuned for specific process needs. MSX-205 utilizes a Multi-Station Turret Chuck Unit to accommodate up to four grinding, lapping and polishing tools at the same time. This feature allows for the simultaneous operation of multiple wafers, ensuring efficient production times. The turret chuck also provides quick tool changes, allowing for the use of different combinations of grinding, lapping and polishing tools. LECO MSX-205 is equipped with a range of grinding tools, including diamond and silicon carbide wheels, grooving and grinding tools, as well as wire brushes. MSX-205 is equipped with a precise wafer motion machine that can be controlled manually or via programmable logic. The tool is also equipped with a PC based control asset and a Windows-based graphical user interface. The model is also compatible with a range of process automation software and other industrial control systems. It is capable of both manual and automated processing, and features a number of preset grind, lap and polish recipes. LECO MSX-205 also offers a variety of accessories for increased efficiency and productivity, including lapping compounds, polishing pads, abrasive papers, wire-brushes, and polishing filters. MSX-205 features a robust construction and is designed to offer a long-lasting and reliable performance. The equipment is ideal for use in in semiconductor production, aerospace and automotive industries.