Used LECO PR-10 #293620358 for sale

LECO PR-10 Wafer Grinding, Lapping and Polishing equipment is a multi-functional surface finishing system designed for use in the Semiconductor and opto-electronics industries. PR-10 utilizes an advanced dual spindle-motor design to enable precise grinding and polishing of wafer surfaces with precise control over all surface parameters. LECO PR-10 unit includes an integrated controller for easy operation and precise control of various process parameters. It includes a precision spindle motor, a multi-axis motion control machine, and both manual and automatic systems for precise, repeatable, and precise grinding and polishing. PR-10 also features a data acquisition tool, allowing the user to accurately monitor the wafer's surface characteristics in real time. LECO PR-10 utilizes an advanced, high-resolution grinding and polishing asset which is capable of producing extremely fine finished surfaces. This is achieved by utilizing a specialized high-precision grinding/polishing motor which is capable of 3000-200000 RPM speed range on the spindle with 0.05 micron precision. PR-10 utilizes a wide variety of grinding/polishing tools such as diamond and abrasive stones, diamond lapping plates, and diamond belts. LECO PR-10 also includes an integrated cooling model for effective heat dissipation and cooling of the grinding/polishing process. PR-10 is equipped with multiple work stations for efficient operation and allows for multiple grinding/polishing processes to be conducted simultaneously. Ideally, LECO PR-10 is used for very precise finishing of wafers and other components. Precision grinding and polishing is used in the semiconductor industry to prepare surfaces for post-processing. Wafers that have been ground with PR-10 equipment typically require no further polishing and are ready for assembly into components. The system ensures accurate and repeatable polishing and permits precise profile control. LECO PR-10 is a reliable, high-performance, and cost-effective choice for precision surface grinding and polishing.