Used LECO Spectrum 2000 #9328697 for sale

LECO Spectrum 2000 is a state-of-the-art wafer grinding, lapping & polishing equipment, designed to provide high throughput and precision processing capabilities for a wide range of wafer sizes. This system has several features designed to provide a high-quality, safe, easy-to-use and reliable process for producing fine-surface finish on wafers, including a built-in process optimization feature. Its design is robust yet lightweight and it is engineered to provide optimal performance in a single pass. The main features of Spectrum 2000 unit include a rotating suction table that holds up to two wafers at a time, ensuring a consistent uniform grinding and a touchless spindle that removes dust, dirt, and other contaminants from the surface of the wafer. It utilizes fixed spindle speeds of up to 4500 RPM with a digital servo drive machine that enables precise speed control. The tool also includes a dual workstation featuring an adjustable air table, stainless steel hood with a dust collector, and a gas-assisted double-sash. This double-sash ensures a closed asset that allows for both grinding and polishing on the same wafer without contaminating the surface or processes. The model is capable of running both dry and wet processes with a range of abrasives. The equipment is powered by LECO patented Trifide ESR technology which allows for controlled, step-controlled processing. This advanced technology shields and protects the wafer from unwanted environmental influences while also optimizing the process by ensuring the exact power and speed are maintained for increased production yield. The system is built to be energy-efficient and is designed to reduce process times and increase process quality and throughput. Its advanced features are designed to keep maintenance and repair costs to a minimum, while ensuring that process conditions remain consistent and optimal. LECO Spectrum 2000 is an industrial-grade unit that provides superior performance for wafer grinding, lapping, and polishing. It is an ideal choice for applications such as semiconductor wafer thinning and wafer cleaning, as well as for other precision wafer processing applications.