Used LECO Vari/Pol VP-150 #120930 for sale

LECO Vari/Pol VP-150 is a wafer grinding, lapping, and polishing equipment designed for precise, accurate, and repeatable finishing for smooth, damage-free surfaces on a variety of materials, including silicon, sapphire and GaAs substrates. This advanced system utilizes grooved contact rolls, water-cooled and adjustable grinding disks, and a power-driven wafer holder that allows for precise, consistent grinding. Built with both manual and programmed operations in mind, the Vari/Pol VP-150 features a simple-to-use graphical user interface (or GUI). This allows the user to easily select the desired parameters of grinding, lapping, and polishing, as well as other operations such as tilt, planorize, and burnish. Furthermore, the user can choose from a variety of preset parameters. This cutting-edge unit features a 12" diameter diamond-coated wafer grinding surface, adjustable disks ranging from 150 to 1600 grit and zero tolerance spindle bearings which enable it to achieve ultra-precise results. The built-in temperature control pump allows the temperature of the coolant flow to be closely regulated. This helps minimize thermal damage and reduce the time for repair and maintenance. In addition, the Vari/Pol VP-150 is equipped with a vacuum powered suction cup that holds the wafer in place during high-velocity grinding for maximum safety and stability. Its dual digital readout micrometers insure accurate component alignment throughout the grinding process and are capable of providing digital feedback regarding the relative position and position setting of the components. This highly innovative machine also has an Automatic Intensity Control Unit (AICU) that can be used to minimize any possible damage caused by manual intervention while the automated process selects the intensity appropriate for each product. Lastly, LECO Vari/Pol VP-150 includes a removable safety shield and foot-operated switch to ensure operator safety at all times. LECO Vari/Pol VP-150 is an incredibly versatile tool that provides precision, accuracy and repeatability in every step of the manufacturing of wafers. It offers a wide range of capabilities and features, including parameters, a GUI, temperature control pump, suction cup, dual digital readouts, automatic intensity control, and a removable safety shield, making it ideal for all of your wafer grinding, lapping, and polishing needs.