Used LECO VC50 #9228654 for sale

LECO VC50 is a multi-functional wafer grinding, lapping and polishing equipment designed to deliver superior results in a range of industries. The system is highly automated and fullly controllable, with a number of core components including an 8-position semiautomatic wafer chuck, grinding and polishing heads, and a single 3-axis manual polishing table. VC50 is capable of grinding 25-300mm wafers on both the upper and lower chucks. To ensure clear and accurate grinding, LECO VC50 is equipped with three grinding/polishing heads equipped with rigid diamond or abrasive grinding plates. VC50's grinding process is monitored by an optical detection unit which provides feedback to the controller to adjust the speed and pressure. In addition to grinding, LECO VC50 also offers lapping capabilities. This takes the form of automatic wafer alignment, lapping process control, and lapping consumables inventory management. The machine includes dual lapping velocity and load control, automated wafer selection, and manual single side or simultaneous dual-side lapping. For perfect polishing results, VC50's 3-axis manual polishing table provides complete control over the polishing process. It has a wide angle learning control tool to ensure symmetrical polishes, and its 45 degree adjustable polishing pads support centering, edge breakouts, and uniformity. In conclusion, LECO VC50 is a versatile wafer grinding, lapping and polishing asset delivering superior results for a variety of industries. The model's advanced technologies, such as its 3-axis polishing table and optical detection equipment, guarantee consistent results every time, while the automated components and manual controls make the system easy to operate and maintain.