Used LECO VP-50 #9124553 for sale

LECO VP-50 is a state-of-the-art wafer grinding, lapping, and polishing equipment designed for high-precision wafer-level processes for the semiconductor, MEMS, and optoelectronic industries. This system is engineered for precision and speed with a large main spindle motor to generate a powerful grinding force on the wafer, while a vacuum chuck prevents the wafer from shifting during the process. VP-50 also ensures a precise and repeatable grinding result with a pre-programmed computer-controlled variable feed rate and an approximate diamond grit size of 550. This unit is also highly precise in its polishing processes with a one-step, high precision, and fully automated process of surface lapping and polishing for wafers up to 200mm in size. This machine is equipped with standard 50mm graphite pad for the polishing process, a self-primer pump for process water and a top-mounted diamond slurry delivery pump for perfect application control of the diamond slurry during polishing. LECO VP-50 also boasts short cycle times due to the fast rough grinding and polishing speeds of up to 40rpm. This tool is also equipped with a user friendly HMI (Human Machine Interface), which is capable of setting up all the asset parameters straightforwardly. Smart alarm messages are available during the operation to inform operators with process status, making sure the process is running smoothly and efficiently, with results meeting high wafer requirements. VP-50 wafer grinding, lapping and polishing model is engineered for high-precision outcomes and reliable cycle times for wafer-level processes. This equipment can produce results accurate to an approximate diamond grit size of 550, with an automated single-step process and a variable feed rate for precise grinding. The system is also equipped with a HMI, graphite pad, and a self-primer pump, allowing operators to set up process parameters easily and monitor the process from start to finish.