Used LOGITECH 1DH31 #9180523 for sale

LOGITECH 1DH31 is a comprehensive wafer grinding, lapping & polishing equipment designed to provide a high-precision, automated solution for thinning & grinding semiconductor wafers. The system provides a high degree of process control and yields consistent results with superior surface finishes. Its precision grinding technologies are optimized to achieve desired thicknesses and surface roughness levels in even the most challenging applications. 1DH31 wafer grinding unit integrates precision motion control and high accuracy motion sensing technology for the highest accuracy in thinning and polishing. The sophisticated motion control technology supports both manual and automated operations, allowing for the programming of sophisticated profiles, linear and circular motions, as well as interpolation of movement. With the highest torque and speed accuracy, users can take advantage of high quality results in demanding applications. The machine is also equipped with a patented Liquid Slurry Transport (LST) tool that provides a continuous supply of slurry to the grinding and polishing plates. This feature helps users to evenly spread slurry across the surfaces, resulting in a uniform finish. The asset also supports a wide range of lapping & polishing steps such as backlapping and machining, grinding and polishing, and dry etching. LOGITECH 1DH31 is a fully automated wafer grinding, lapping & polishing model designed to bring the highest level of precision and automation to production processes in the semiconductor industry. With its advanced motion control capabilities, high-accuracy motion sensing technologies, and patented LST equipment, the system is capable of delivering consistent results and yielding high-quality surface finishes. This unit also offers users an easy way to optimize their processes and fine-tune throughput time and costs. 1DH31 is an ideal solution for semiconductor manufacturers and other industries requiring accurate and reliable wafer grinding, lapping, and polishing.