Used LOGITECH 1PM45 #9215261 for sale

LOGITECH 1PM45 is a wafer grinding, lapping, and polishing machine designed to efficiently and accurately improve the surface roughness, machining tolerances, and shape of a wide range of semiconductor and optoelectronic materials. This workstation-level 1PM45 machine provides a versatile platform for all stages of metallographic wafer preparation. It features a heavy-duty spindle motor with variable speed control for high-precision grinding. With its powerful grinding capabilities, high accuracy, and impeccable safety features, LOGITECH 1PM45 is suitable for almost any wafer preparation stage. 1PM45 includes two wafer holders attached to the grinding heads. These holders are adjustable for the range of wafer angles required for grinding, lapping, and polishing operations. The grinding heads also feature a pneumatic hold-down equipment that maintains adequate pressure on the wafers during grinding. LOGITECH 1PM45 is equipped with several interlocking and safety features that protect both the user and the wafers from dangerous or damaging incidents. The integrated Control Console and Software maintains the parameters for each grinding, lapping, and polishing operation, allowing the user to customize their process. 1PM45 has an integrated, closed-loop, vacuum system that securely holds the wafers in the holders, while preventing them from shifting during machining. This unit also eliminates the need for manual suction cups. The machine also features a variety of attachments including wipers, discs, rings, stones, and software accessories, providing the user with a comprehensive wafer preparation tool. LOGITECH 1PM45 can accommodate several wafer sizes. It has an adjustable bed length, adjustable height, and adjustable speed. The speed control asset allows for varying levels of grinding pressure and produces a range of results. With the added measure of safety, the user can work confidently even at higher speed settings. 1PM45 also includes attachments such as grinding discs, regular grinding stones, diamond-coated grinding stones, and more, providing users with incredible flexibility when grinding and polishing wafers. In conclusion, LOGITECH 1PM45 is an impressive wafer grinding, lapping, and polishing machine. Its adjustable bed length, adjustable height, adjustable speed, and variable speed control provide users with precision control, while the integrated vacuum model and several safety interlocking features guarantee a safe work environment. 1PM45 includes a wide range of attachments, giving users full control over their wafer preparation process.