Used LOGITECH CDP #9083833 for sale

LOGITECH CDP is a wafer grinding, lapping and polishing equipment designed specifically for cutting down and shaping semiconductor materials. CDP consists of a main spindle, an abrasive wheel, special fixtures and a computer controller unit. The main spindle of LOGITECH CDP is mounted horizontally and operates in conjunction with a brushless motor drive. This enables the machine to work with precision at higher speeds. The abrasive wheel of CDP is dedicated to grinding and polishing semiconductor material. This wheel is controlled using a pneumatic torque arm and a hydraulic flow controller that enables LOGITECH CDP to grind, lap and polish wafers with an extremely uniform finish. The spindle speed can be adjusted and controlled independently, ensuring greater speed control while working with semiconductor material. The special fixtures of CDP are essential for properly securing the surface of the wafer while it is being ground and polished. LOGITECH CDP also features an integrated security system to prevent unintentional abrasive contact during servicing operations. Furthermore, CDP features a safety door to prevent accidental entry of a user into the machine's working area. The computer controller unit of LOGITECH CDP is responsible for the proper functioning of the unit and is equipped with an LCD display for monitoring grinding and polishing progress. The controller also includes a user interface and a programming port that allows the operator to set and control the abrasive wheel speed, grinding depth, and feed rate. CDP is also equipped with a vacuum plate filter unit that collects and filters the chips and fines generated during the grinding process. Overall, LOGITECH CDP is designed to shape and finish semiconductor materials with accuracy and precision. It features a brushless motor drive and a dedicated abrasive wheel, combined with secure fixtures and a comprehensive computer controller unit. CDP also has a safety door and a vacuum plate filter machine to ensure safe operation and clean grinding.