Used LOGITECH IPM 45 #9400680 for sale

LOGITECH IPM 45 is a comprehensive wafer grinding, lapping, and polishing equipment. This machine uses a precisely-controlled grinding, lapping and polishing process to produce a defect-free surface finish on semiconductor wafers and other delicate components that require a flat and smooth surface. This system is designed to offer an efficient and cost-effective means of obtaining a high-quality surface finish related to semiconductor wafer processing. The main unit of the unit is the grinding section, which is equipped with three spindles—one for the grinding wheel and two for the grinding plates. The grinding wheel is designed with diamond abrasive particles, which are able to remove material from the wafer's surface quickly and accurately. The two grinding plates located on either side of the grinding wheel move in an orbital and radial pattern, allowing for a complete uniform surface finish. The lapping section is designed to achieve a micro-fine surface finish on the wafer. It features two lapping plates with a horizontally-oriented grooves that enable the wafer to be pressed against the lapping plate while the two plates are being rotated at the same time. The lapping plates are then calibrated so that they can be used to finish and condition the wafer surface. The polishing section is equipped with a variable-speed drive motor, which allows it to precisely control the revolutions and speed of the polishing disc. This precision motion is used to apply a uniform finish to the wafer's surface without creating any damage or degrading the surface quality. The polishing disc is fitted with diamond particles, which are able to quickly and accurately polish the wafer surface. Additional features of IPM 45 include a frequency-controlled heater, which is used to heat the lapping and polishing plates to the optimum temperature for obtaining an optically flat and smoother finish on the wafer surface, as well as a vacuum machine that aids in rapid removal of grinding and polishing residues. Overall, LOGITECH IPM 45 is a versatile and powerful automation tool that features a variety of features such as grinding, lapping, and polishing capabilities. It offers a precision-controlled process to attain a defect-free surface finish on delicate semiconductor wafers and other components, enabling customers to obtain the optimal result with minimal effort and cost.