Used LOGITECH LP50 #293664638 for sale

LOGITECH LP50 Wafer Grinding, Lapping & Polishing equipment is a semi-automated, top-loading polishing and grinding system designed for high volume wafer processing. This unit offers an effective and precise method for machining a wide range of wafers including silicon, silicon dioxide, and other wide range of materials. LOGITECH LP-50 includes a non-contact grinding head, together with a lapping and polishing module. This machine enables the user to provide incredibly precise and repeatable results using all kinds of wafers. The non-contact grinding head is used to grind the wafer to a specific depth which can vary for different applications and materials. It can be configured to either grind free form surfaces, to a certain depth, with a uniform pattern, or to create a flat surface on a wafer. This results in a precise result with a low level of material waste. The grinding head is also equipped with adjustable pressure control which prevents the grinding head from becoming overloaded meaning it can work on larger wafers without the need for manual intervention. The lapping and polishing module removes pitting, dips, and scratches from the surface of the wafer before polishing. Lapping is conducted under a bath of slurry, allowing for precise control over the surface finish for even the most challenging applications. It also allows for the removal of any surface imperfections, before polishing. The drying stage removes all residue and debris from the surface of the wafer, and the polishing stage is used to ensure a perfect surface finish. LP 50 offers flexibility with the wide range of tooling and polishing supplies such as diamond fines, foam, and polishing particles. This flexibility enables production for a wide range of sizes and shapes. With the addition of a vacuum chuck and its proprietary grinding head, a wide range of wafers from 10mm to 100mm can be processed in single run. Furthermore, the tool is designed to be dust-free, eliminating the need for expensive filters or extraction systems. Overall, LP-50 provides a reliable and highly precise asset for grinding, lapping, and polishing wafers. With its semi-automation, adjustable pressure control, dust-free environment, and its wide range of polishing supplies, this model provides the capacity for short cycle times with considerable time savings and efficiency improvements. In addition, it offers a cost-effective solution with the ability to produce a high quality result on a wide variety of wafers and materials.