Used LOGITECH LP50 #9011728 for sale

LOGITECH LP50 is a wafer grinding, lapping & polishing equipment designed to hold and process up to twelve 6"/150mm wafers. The system is especially well-suited for smoothing small defects in the wafer surface, surface planarity, and surface roughness. This is accomplished via mechanical lapping & polishing, as well as chemical and physical mechanical polishing. The machine is equipped with a integrated 4-axis control unit to reliably control a multitude of wafer processing parameters. This includes the grinding, lapping, and polishing of the wafer, the selection of the appropriate grinding and polishing tools, as well as the speed and pressure with which each process is carried out. The control machine is also capable of controlling the water pressure and flow rate for each step in the process, as well as controlling the temperature of the polishing fluids. The machine features a low profile, compact design that make it suitable for tight working environments. The robust and stable construction ensure consistent and reliable performance. The machine is also equipped with several safety features, such as an automatic shutoff valve for control of the water pressure, temperature and flow rate, and a lapping hood which is designed to prevent operator contact with the spinning grinding and polishing tools. LOGITECH LP-50 is designed to provide highly precise and consistent results, with a minimum surface roughness of 0.1µm, a minimum surface flatness of 0.2µm, and a maximum thickness variation of 0.5µm. It is the most advanced and capable wafer grinding, lapping & polishing tool currently available, and the perfect choice for applications such as ultra-flat KOH or TMAH polishing, and EBSD/X-ray diffraction analysis.