Used LOGITECH LP50 #9166774 for sale

LOGITECH LP50 is a wafer grinding, lapping and polishing equipment, designed to perform single operation processes on semiconductor wafers up to 200 mm in diameter. Compact and easy-to-use, LOGITECH LP-50 offers automated operation, eliminating manual operations and ensuring consistent results. LP 50 is capable of dual- and single- side grinding, single- and dual-side lapping and single-side polishing, all in a single step; it also has the ability to integrate additional process or metrology steps. Its exchangeable wheel module, combined with a unique dynamic pressure sensing technology, enables it to achieve the required flatness and roughness with precision and accuracy. The system can also accommodate various consumables, depending on the process, including diamond grit grinding wheels, lapping platters, and polishing pads. LP-50's robust control unit and software, controlled via touchscreen, make it easy to setup and monitor the process, including loading and unloading of wafers. The machine also has the ability to monitor the process in real time using motor torque, wheel position, and wafer temperature, allowing operators to adjust parameters accordingly. LOGITECH LP 50 has multiple safety and protection features designed to protect both the operator and the tool. It comes with a fail-safe emergency stop feature, built-in temperature sensors to monitor the temperature of the wafer, built-in pressure sensors to detect excess pressure applied to the wafer, as well as a force control mechanism that ensures optimal repeatability and homogeneity across the entire surface of the wafer. Overall, LP50 is an ideal asset for those in need of premium grinding, lapping and polishing solutions operating in an R&D or production environment, offering repeatable and consistent processes, greater control, and superior safety features. With its unique features and robust software, it is sure to provide reliable and efficient operation in a range of complex process.