Used LOGITECH LP50 #9193387 for sale

LOGITECH LP50 is a wafer grinding, lapping, and polishing equipment designed with industry leading technology and innovation to meet the most demanding processing needs. The system is equipped with a high resolution atomic force microscope (AFM) enabling precise surface measurements and characterization. The unit is designed with a reliable, closed-loop electromechanical drive machine to ensure accuracy and repeatability of motion. Additionally, it has a vacuum operating pressure of 0.2 mBar, which allows proper adhesion between each wafer surface and the tool. LOGITECH LP-50 also features a precisely-controlled grinding, lapping, and polishing process, with a manual or automatic loading mechanism for different sizes and shapes of wafers. The grinding, lapping, and polishing is done with a unique abrasive media, and the result is a wafer surface that is optically homogeneous, exhibiting excellent surface finish and uniform overall. The asset also has an advanced software for controlling the entire model, allowing for full automation and customization. The software features a customizable GUI for easy use and operation, as well as provides full control over the speed and position of the wafer. In addition, the software includes a powerful algorithms that can provide highly accurate surface measurement results, as well as advanced capabilities to record and analyze the process parameters over time. To ensure quality results, LP 50 is equipped with an integrated controller that allows the user to adju