Used LOGITECH LP50 #9213809 for sale

LOGITECH LP50 wafer grinding, lapping, and polishing equipment is an automated system designed for making high-precision microstructures. The unit is designed to manufacture components such as MEMS devices or other semiconductor devices with nanometer or submicron precision. The machine uses a combination of grinding, lapping, and polishing to achieve precision processing of ultra-thin wafers and MEMS substrates. The wafer is loaded onto a precision-controlled carrier in the machine. The carrier is then clamped onto the grinding head providing stability during the grinding process. The grinding head consists of a diamond grinding wheel that is driven by a motor and travels in a linear direction. The speed of the motor can be adjusted to achieve the required grinding rate. After the grinding process is complete, a lapping stage is used to further smooth the surface of the wafer. This stage consists of using a fine diamond abrasive that is pressured against the surface and moved in a circular motion. The lapping process is used to prepare the surface for the final polishing step. The final polishing stage is performed using a unique material called LogiPol. This material is applied to the wafer using a robotic arm that slides it back and forth in a circular motion. This motion is applied with polishing pressure that evenly distributes the material across the surface of the wafer. The polishing process is completed by repeating this process several times in order to achieve the required grade of polished surface. The quality of the finished product can be assured by inspecting it with an automated inspection tool on the machine. This asset is capable of detecting small surface irregularities, detecting surface finish, and confirming the geometry of the chips. LOGITECH LP-50 model can be used to process wafers that range in sizes from 25mm to 12 inch and have a surface finish accuracy of up to 10 angstroms (10-10 meter). The equipment is designed to automate the entire process, eliminating human intervention and providing a consistent level of quality. The system is capable of continuously monitoring the process and providing feedback to ensure that the process is continually optimized for the highest quality.