Used LOGITECH LP50 #9228549 for sale

LOGITECH LP50 is a wafer grinding, lapping and polishing equipment, designed for manufacturing semi-conductor ICs, MEMs, III-V, Optoelectronics, sensors, and other sensitive materials. This system provides high precision and controllable fabrication processes. LOGITECH LP-50 utilizes an ergonomic manipulation chamber, designed to facilitate rapid and accurate loading and unloading of processing wafers, while offering complete protection against contamination. LP 50's grinding and lapping stage is equipped with a diamond grinding wheel and a set of interlocking polishing pads, which enable fine control over the grinding process. The unit is capable of polishing wafers down to a thickness of 0.1-2mm, with minimal damage to the surface. LP-50 also features a two-dimensional, pressure-controlled polishing head to remove surface damage and imperfections from the wafer surface. The pressure of the diamond-tipped polishing pads can be adjusted to ensure a smoother finish with improved uniformity. LP50 is designed for high-precision polishing operations, with a maximum wafer diameter of 300mm and a wafer holding force of 8Kg. Its high-precision design enables precision grinding, lapping and polishing to yield incredibly smooth surfaces with minimal roughness. LOGITECH LP 50 is also equipped with multiple modules to meet various customer needs. An edging module provides complete control over the beveling and edge trimming process. A layering module allows users to coat wafers with coating up to 0.4mm thick, allowing for precise control over material properties, such as dielectric constants or thermal coefficients. LOGITECH LP50's vacuum-tight, contamination-free design ensures that wafers remain free from contamination during processing and handling. Additionally, the machine's programmable control center allows for easy customization of the polishing parameters, such as grinding speed, pre-loading force, and polishing pressure. In summary, LOGITECH LP-50 is a reliable, high-precision tool for grinding, lapping and polishing wafers. It offers a versatile range of processes, with complete control over the grinding, lapping and polishing parameters, allowing you to achieve precision results. Its ergonomic, vacuum-tight, contamination-free design means that wafers remain free from contamination during processing and handling, ensuring the highest standards in wafer production.