Used LOGITECH LP50 #9229494 for sale

LOGITECH LP50 wafer grinding, lapping and polishing equipment stands out as the ultimate precision wafer processing platform for back grinding, lapping and polishing. Specifically designed to grind and polish a variety of wafer sizes and shapes with precision, the system provides superior micro-finish and accuracy. LOGITECH LP-50 employs a longitudinal traveling table and a cross-slide with hydraulic fixture for perfect wafer centering. The table can run with extremely high accuracy, resulting in uniform grinding and lapping even on large-diameter substrates. It also is designed to can handle higher feed rates that result in lower cycle times. The unit uses linear grinder controllers, such as LOGITECH NET22 GRP-50 which adds to the precision of LP 50. It consists of three separate grinder servomotors combined into one unit with precise speed and position control for the table and cross-slide axes, leading to improved grind accuracy. The Liquid Metal Lapping technology integrated with LP50 improves grinding quality with less wafer deformation. This is combined with the machine's reduced noise and vibration, providing a better working environment. LP-50 is also equipped with the WaferEdge Pro HE ultra-high precision small diameter wheel grinder with the latest technologies. This allows for increased wheel speeds up to 10,500 rpm, and fine pitch grinding capability down to 0.004mm for micro-finishing the edges of wafers with extraordinary quality. Finally, the tool's Automated WaferGap allows for automated grinding, lapping and polishing, with tight consecutive registration and a maintained gap through the entire length of the chain. Accurate gap measuring is provided by the MicroLap device, and a computer-controlled asset operates LOGITECH LP 50 to ensure accurate gap measurements are maintained through the process. LOGITECH LP50 is an essential wafer processing platform for precision grinding, lapping and polishing. Its finely-tuned components and advanced technologies, such as Liquid Metal Lapping and WaferEdge Pro HE, lead to extraordinary microfinishing, shorter cycle times and improved grind accuracy. The Automated WaferGap helps keep the gap consistent through the entire process, while the reliable and accurate controllers add even more to the model's precision.