Used LOGITECH LP50 #9243811 for sale

LOGITECH LP50 is a wafer grinding, lapping and polishing equipment designed to provide planarizing operations for semiconductor wafer fabrication. The system is intended for use in production, especially for high aspect ratio and multi-level processes. LOGITECH LP-50 features a unique CNC (Computer Numerical Control) grinding spindle, which is able to automatically adjust the spindle speed based on the varying forces created by the grinding process. This allows for higher production yields and greater uniformity throughout the production process. The adjustable speed also helps to reduce cycle times. Additionally, the spindle speed can be adjusted manually, offering more control for manual grinding operations. LP 50 also features an AC servo motor which provides high torque and positioning accuracy. This helps minimize chatter and improves the wafer surface finish. The unit also includes a vacuum chuck to fix the wafer in place. The device can be adjusted for different crystal orientation and substrates. In addition, LOGITECH LP 50 offers an integrated wafer scanning machine, allowing for the production of very fine features. This provides high-resolution feature recognition and the ability to reproduce more intricate process steps with precision. The integrated tool also enables higher throughput operations, as it automates the process of monitoring and controlling operations. LP50 features a variety of process control systems, which are integrated to provide the user with greater control. This includes automated temperature and pressure control systems, which helps ensure optimal process conditions. Additionally, the asset has a user-friendly graphical interface which allows for easy programming and control. Finally, LP-50 offers high levels of process control during operation, with several safety features designed to protect the operator and the model itself. These include an emergency stop equipment, an alarm system, and an alarm management unit. This helps to ensure secure and safe operation of the machine. Overall, LOGITECH LP50 is an excellent tool for wafer grinding, lapping and polishing. It provides high-precision operations and efficient asset control. It also provides automatic spindle speed adjustment for greater production yields. Additionally, the integrated wafer scanning model offers high resolution feature recognition and reproducing intricate process steps. This makes it an ideal equipment for production and wafer fabrication.