Used LOGITECH LP50 #9248562 for sale

LOGITECH LP50 is an innovative wafer grinding, lapping and polishing equipment designed to increase efficiency and throughput for advanced semiconductor applications. The system features a high-precision construction along with a powerful drive mechanism, making it suitable for use in a variety of precision lapping operations. LOGITECH LP-50 grinding, lapping and polishing unit is capable of reaching superior yield rates, with excellent roughness control, in high-throughput environments. The machine consists of several parts, such as a robust spinning document, a four wheel loading tool, and a lapping ring assembly. The rugged spinning document utilizes a rotary drive tool to deliver maximum precision and accuracy at up to 94,000 rpm. This allows it to cut wafers in the direction of the wheel assembly. The four-wheel asset provides adjustable tension and speed control to ensure accurate lapping. The substrate being processed is placed in a lapping ring assembly which is held in place using a sliding clamp assembly. This ensures proper alignment and repeatability during the lapping process. LP 50 grinding, lapping and polishing model uses a unique "Contact Control" equipment to create a precise, superior finish on the wafer. The Control system utilizes a servo-based algorithm to control the contact force between the lap and the substrate. This ensures that there is uniformity and consistency throughout the lapping process. The unit also reduces vibration and chatter which can affect the quality of the surface finish. The machine is also equipped with a range of advanced process monitoring tools. The tool can be customized to display data in a variety of graphs and charts, allowing users to easily track and monitor the lapping and polishing processes. This makes it possible to quickly implement process changes at any given stage in the operation. LP50 grinding, lapping and polishing asset is a reliable and versatile model that eliminates the need for manual cleaning and minimizes labor costs, while providing maximum results. The equipment is optimized for use in a variety of production environments, including those with high-throughput requirements. It is an excellent choice for semiconductor professionals looking for a reliable and efficient system for grinding, lapping and polishing their wafers.