Used LOGITECH LP50 #9302512 for sale

LOGITECH LP50 Wafer Grinding, Lapping & Polishing Equipment is a state-of-the-art machine used in the fabrication of semiconductor and optical components. This machine is capable of providing high-precision machining on a variety of materials including silicon-on-insulator (SOI), gallium arsenide (GaAs), and gallium nitride (GaN). LOGITECH LP-50 is a dual-purpose tool specifically designed to perform precision grinding and polishing, as well as lapping and polishing. This high-performance machine features a patented, adjustable spindle speed system capable of producing uniform surfaces with a Root Mean Square (RMS) surface roughness of 2nm. This machine is designed for the most demanding applications, capable of providing high levels of accuracy and repeatability with minimal operator intervention. LP 50 is outfitted with a loaded power distribution unit, a high-precision air bearing spindle, and a pneumatic lapping unit, providing users with maximum flexibility and control over each machining process. Additionally, this machine has an advanced two-step grinding mechanism that allows for precise positioning of the grinding wheel relative to the substrate, as well as an adjustable wafer sizer for precise lapping of the substrate material. The tool is designed for efficient operation, as it features a completely automated programmable sequence controller which can be tailored to each job. This reduces setup time and ensures fast and reliable machining operations. Furthermore, this asset includes a built-in data logging model to monitor the entire machining cycle and store the process results for future product quality reference. LP-50 is capable of producing high-quality machining results on a variety of substrates with ease and accuracy. It is an ideal choice of equipment for any semiconductor or optical component manufacturer looking to achieve precise and repeatable machining results with every cycle.