Used LOGITECH PM2 #9211679 for sale

LOGITECH PM2 is an advanced wafer grinding, lapping and polishing equipment designed to produce exceptionally smooth and flat surfaces on various materials. The system features robust construction, precision engineering, and an intuitive user interface, making it an ideal solution for a wide range of fabrication needs. The unit features dedicated on-board grinding and lapping machines specifically designed to process various materials. The HSG-2 grinding unit is capable of grinding materials up to 0.01 mm in thickness, and features a direct drive, no-load design, and hydraulic power-assisted lift table. The HSG-2 also offers programmable areas, a self-centering spindle, and a floating head for polishing. The HSG-2 is designed for maximum speed and accuracy. The HSG-2 lapping unit uses diamond wheels to systematically produce highly consistently flat surfaces on different materials. Both the grinding and lapping units are connected to an automated overall machine that helps to ensure accurate process control. The automated tool helps the operations to be efficient and consistent throughout. LOGITECH PM 2 also features a series of automated systems to help ease the production process. This includes an automated cleaning asset that helps to keep the wafers clean and free of contamination. This is important in order to ensure the highest quality end product. Furthermore, PM2 can be programmed with special parameters to assist with a variety of production needs. This includes the ability to save up to 99 grinding programs that can be called up at any time. PM 2 is the perfect solution for those who need a robust, accurate, and easy to use model. With its advanced grinding and lapping capabilities, automated features, and simple user interface, LOGITECH PM2 is the ideal equipment for any precision fabrication needs.