Used LOGITECH PM2 #9223573 for sale

LOGITECH PM2 is a wafer grinding, lapping and polishing system designed specifically for larger scale production. It provides high productivity and flexibility via an easy to use closed-loop process in both batch and inline configurations. LOGITECH PM 2 is widely used in the semiconductor industry for grinding, lapping and polishing flat wafers of any size and thickness. It can handle both Silicon and Sapphire substrates, and can be integrated with other wafer processing equipment. PM2 uses an A3-sized clamping plate, allowing for clamps of various sizes and shapes to be adjusted and tightened. This allows the user to easily set up and start the grinding process quickly. After the clamp is secured, a DC horizontal stepper motor is engaged to rotate the flat grinding stone that is pressed against the wafer. This action creates a uniform grinding effect over the entire wafer. In addition to the horizontal motor, a programmable actuation platform is employed to accurately rotate the stone. This is achieved by driving a plate upward at a preset speed as the grinding stone is pressed against the substrate. The speed of the actuation platform motor can be adjusted for optimal performance and to ensure homogeneous grinding. Furthermore, PM 2 utilizes an abrasive grinding stone to minimize or avoid the risk of damaging the wafer's edges. LOGITECH PM2 is also equipped with two diamond lapping tools for lapping the wafer edge. These tools are made up of two diamond laps, one with a flat surface and the other with a rounded surface. The two laps are positioned so that they are free to move across the wafer edge, polishing it. The flat lap is used to remove any burrs and the rounded lap is used to give the wafer edge a smooth finish. LOGITECH PM 2 also includes two polishing polish, each of which uses a water-cooled, highly flexing, knurled abrasive polishing tool. These polishing tools clean and polish the entire wafer surface, leaving it smooth and even. PM2 also includes its own in-situ laser profiling system, which is integrated into the machine itself. This system measures the thickness and geometry of the wafer during the process to ensure that it is held to a precise tolerance. PM 2 is a reliable and efficient way to grind, lap, and polish any size and type of wafer in both batch and inline configurations. Its robust construction and wide range of features make it an ideal choice for high-volume production environments. With accurate process control and precision grinding, it is the perfect solution for any wafer processing task.